Sorry for the big lag in posting! Its been over a week but not much has been going on. I went to my interview of course and that went GREAT. I was invited down to Cincinnati to meet some of the engineers and other employees at that T-Mobile office. I am really encouraged by the response I’ve been getting from this job interview process.
I would say I’m about 90% I will get offered the job, but we’ll see on or around the 19th of this month when I go down there.
Other than that our Robot project is coming along nicely and I had a ECET 357 practical (we write assembly code for an Analog 2181 DSP development board) and I blew through that thing in about 1.5 hours. I heard that most people weren’t even finishing so I was pleased.